Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Node Development PE CPI Team Leader will lead a small team inside the DEGT (DRAM Engineering Group – Technology) focusing on successful development, early qualification, and ramp of Micron’s existing and future Packaging Technology and its integration with the front end fabrication process! 

As we continue to move to higher stacks in packages, thinner die in packages, and wafer bonding process this role becomes more and more critical.   This team will be successful if the Packaging Technology and interaction with front end manufacturing process are fully developed and qualified well ahead of any qualification of the product itself!

This team will partner with the Business Units, DEGT Design, Assembly PDE, APTD, TD PI, and MFG PI teams to define each node’s Packaging Technology roadmaps and define a test vehicle for each node.  This team will collaborate and validate in silicon the packaging technology needed for the DRAM Node including design rule and process margin validation on that targeted test vehicle.  Once the packaging technology is validated on the test vehicle, the team will then focus on product development and qualifications by innovating and integrating novel live die metrology, inline fab metrology, post assembly metrology, and ultimately link the Assembly Process to the front end manufacturing process for line health and front end fab conversion process to provide high quality final products for the life of a DRAM node.  

Responsibilities Include:

• Develop strong relationships with Business Units and DEG Pillars, Assembly PDE, APTD, TD PI, MFG PI, DEGT Design/PE, and TSE teams.

• Understand DRAM scaling challenges, opportunities, and competitive threats.  Work with peers to ensure Development activities in Si will keep Micron in a Technology leadership position. 

• Co-define a test vehicle per node for early technology development.

• Co-develop Packaging Technology that is reliably integrated with front end mfg. process and qualified well ahead of critical path NPI for the Alpha DRAM on the node through Si validation of the test vehicle. 

• Support each DID on each node as it qualifies and help to quickly resolve any mechanical related failures related to packaging or packaging process interaction with front end process.  This responsibility should require less effort as the team improves the overall early development process.

• Optimize existing process conversion business process to include visibility and metrics around die strength and other CPI key knobs that were identified in the early development process.

• Be the experts in BE and FE data analysis related to packaging and mechanical performance of our packages. 

Qualifications:

• Bachelor's degree in electrical, computer, or mechanical engineering or equivalent

• Proven experience with semiconductor packaging technology, qualification and reliability mechanisms

• Proven industry semiconductor development experience

• Familiarity with DRAM architecture, operation, testing, design, and process

• Effective written and spoken communication skills

• Good interpersonal skills

• Excellent problem solving and analytical skills

• Strong presentation skills

• Self-motivation and passion

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.